Integrated circuit module and method of making same
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United States of America Patent
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-
Jan 28, 1986
Grant Date -
N/A
app pub date -
May 18, 1983
filing date -
May 18, 1983
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
An integrated circuit module adapted to connect an integrated circuit to an electrical connector. A lead frame (20) with lengthened leads (22), compared to the lead frame of a conventional DIP packaged IC, is laminated to a nonconductive substrate (46). The leads (22) of the lead frame have contact ends (28) laminated in spaced relation along a contact edge (52) of the substrate (46) for contacting the electrical connector. The use of a printed circuit board and the necessity for soldering the IC thereto are thereby eliminated. The leads (22) may comprise two sets (48,54) with the first set (48) laminated to a first surface (50) of the substrate (46) and the second set (54) wrapped around an edge of the substrate (46) and laminated to the second surface (56). The IC module may include a hermetically sealed IC chip (26) electrically connected to the lead frame (20) with interconnecting wires (22) and substrate (46) may be shaped to allow external electrical components to be mounted on the IC module. The method of making the IC module is also provided.
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