Semiconductor chip mounting system
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United States of America Patent
Stats
-
Mar 11, 1986
Grant Date -
N/A
app pub date -
Mar 19, 1984
filing date -
Mar 19, 1984
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A semiconductor chip module with a flat mounting surface is disclosed. A wafer-scale silicon semiconductor chip is provided with electronic circuits formed therein. The chip has a metallized back face and contacts on the opposite, front face. A solder layer secures the metallized back face of the chip to the mounting surface substantially without voids.
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