Automated burn-in board unloader and IC package sorter
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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-
Apr 29, 1986
Issued Date -
N/A
app pub date -
Mar 8, 1985
filing date -
Oct 26, 1983
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
There is disclosed herein an apparatus for unloading IC packages from sockets on a burn-in board according to predetermined performance grades. The IC packages are displaced from the sockets by inserting tools through passageways extending through the burn-in board and socket to contact the underside of the IC package and push the IC package from its socket. Sorting is accomplished by collecting the displaced IC packages of a particular grade and storing them separate from all other IC packages.
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