High density mother/daughter circuit board connector
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United States of America Patent
Stats
-
May 6, 1986
Grant Date -
N/A
app pub date -
Apr 9, 1984
filing date -
Apr 9, 1984
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A high density mother/daughter circuit board connector utilizes a multi-layer flat flexible circuit, each layer of which contains a plurality of patterned arrays of circuit paths extending between spaced contact points, at least some of which are exposed through apertures in overlying layers. The multi-layered circuitry is wrapped around a housing from a mother circuit board face to extend into one side of a daughter board receiving recess. Camming means arranged in the opposite side of the recess drive a daughter circuit board inserted therein transversely of the recess into loaded engagement with the multi-layer circuitry thereby establishing electrical interconnection between the circuitry of the mother and daughter circuit boards.
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