Aqueous silica compositions for polishing silicon wafers
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United States of America Patent
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May 13, 1986
Issued Date -
N/A
app pub date -
May 20, 1985
filing date -
Oct 15, 1984
priority date (Note) -
Expired
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Abstract
A composition useful in polishing silicon wafers and like materials which comprises an aqueous colloidal silica sol or gel and from 0.1-5% by weight based on the SiO.sub.2 content of the sol or gel of piperazine.
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