Surgically implantable electrode for nerve bundles
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United States of America Patent
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May 27, 1986
Grant Date -
N/A
app pub date -
Jun 14, 1984
filing date -
Jun 14, 1984
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A surgically implantable electrode system has been conceived which includes two or more electrical elements embedded in a helically wound substrate made of insulative material. The contact elements are connected to electrical lead-in conductors which are encased in the substrate and extend from a common end of the substrate to a contact element. The substrate is wound around a nerve or nerve bundle in helical fashion until the contact elements are positioned against the nerve or nerve bundle surface at the desired location. A membrane is wrapped around the substrate to insulate the electrode system, and the lead-in conductors are anchored to relieve strain on the electrode system.
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