Curing composition containing polyether having reactive silicon-containing group and a (meth)acrylate polymer

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United States of America Patent

PATENT NO 4593068
SERIAL NO

06542995

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Abstract

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A curing composition which comprises (A) a polyether having at least one reactive silicon-containing group in the molecule and (B) an acrylate polymer and/or an methacrylate polymer. The composition of the present invention has excellent weatherability, adhesive property, initial tackiness, especially at a low temperature, cohesive force, workability and stickness and is useful as a pressure sensitive adhesive, a sealing material, and the like.

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Patent Owner(s)

Patent OwnerAddress
KANEGAFUCHI KAGAKU KOGYO KABUSHIKI KAISHA2-4 3-CHOME NAKANOSHIMA KITA-KU OSAKA

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Hirose, Toshifumi Kobe, JP 31 826
Isayama, Katsuhiko Kobe, JP 44 1347

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