Electrical component encapsulation package
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United States of America Patent
Stats
-
Jun 10, 1986
Grant Date -
N/A
app pub date -
Oct 22, 1984
filing date -
Oct 22, 1984
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
An electrical component encapsulation package including a cover; a base including a peripheral frame with a large central hole; and support means for mounting the electrical component above and spaced from the frame for providing an open space between the frame and component for introduction and flow of encapsulating material, and to insure integrity of the electrical connections.
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Family
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Cited Art Landscape
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