Importance

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Abstract

A wire bonding method and device in which a bonding tool for holding the leading end of a bonding wire and a wire clamp for clamping the bonding wire at a position between the bonding tool and a bonding wire supply spool are vertically moved independently of each other, thereby electrically interconnecting between a semiconductor pellet and an external terminal by means of the bonding wire. When the wire clamp is closed so as to clamp the bonding wire and is lowered by a predetermined distance, the bonding wire of a predetermined length can be extended beyond the leading end of the bonding tool. Driving mechanisms for causing the vertical movements of a bonding arm and a clamp arm are so improved that the vertical displacements of these arms are in proportion to the angle of rotation of a drive motor. The displacements of the bonding tool and the wire clamp can be directly controlled in response to the angle of rotation of the drive motor so that the complicated controls can be accomplished correctly. The velocity of the bonding tool moving from a first bonding position of the semiconductor pellet to a second bonding position of the external terminal, and the vertical shifts and shifting velocities of the bonding tool and the wire clamps are determined based on the distance between the bonding positions. Through control of the drive of them, desired loci of movement are attained.

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First Claim