Pressure interconnect package for integrated circuits
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United States of America Patent
Stats
-
Jul 1, 1986
Grant Date -
N/A
app pub date -
Mar 19, 1984
filing date -
Mar 19, 1984
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A pressure interconnect package for connecting an integrated circuit chip to an etched circuit board comprising a pressurized stack of circuit elements in which a flexible interconnecting circuit is disposed between the IC chip and the etched circuit board to cause them to make electrical contact upon the application of pressure to the stack.
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