Wafer chuck
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United States of America Patent
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-
Aug 5, 1986
Grant Date -
N/A
app pub date -
Feb 17, 1984
filing date -
Feb 17, 1984
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
The wafer chuck disclosed herein is adapted to hold a semiconductor wafer during high energy treatment in a vacuum environment. The wafer is clamped by its rim to a circular domed plate so as to distort the wafer into close proximity with the domed face of the plate. Ports are provided in the face of the plate for introducing a mobile gas under controlled pressure to the interstitial space between the wafer and the domed face of the plate. An annular groove is provided around the periphery of the domed face and this groove is connected to a vacuum pumping means thereby to minimize leakage of the mobile gas into the vacuum environment.
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