Wire bonding apparatus
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United States of America Patent
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-
Aug 5, 1986
Issued Date -
N/A
app pub date -
Apr 2, 1985
filing date -
Aug 24, 1982
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A wire-bonding apparatus which employs a belt-and-pulley driven, spring-returned Z-motion plate to appropriately locate a wire-axis-aligned, solenoid operated, wire feed-and-tear apparatus so that bonds can be quickly and effectively made upon devices located on an X-Y movement table.
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Cited Art Landscape
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