Method of temporary solder assembling of releasable plates for mechanical release device
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United States of America Patent
Stats
-
Aug 26, 1986
Grant Date -
N/A
app pub date -
Nov 8, 1984
filing date -
Nov 9, 1983
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A method is provided of temporary assembling by soldering of peel off plates through soldering material and a flexible junction element for a mechanical release device to release two parts temporarily fixed edgewise by peeling off the flexible element and the soldering material. There is provided on the plates and flexible junction element reserved areas without any adherence to the soldering material, and preferably at the limits of said reserved areas, a recess for removing any excess of soldering material, and the melting solder material is put under load for distributing it between the plates and the flexible junction element. A so obtained assembly can be applied particularly to obtain automatic opening of containers in particular in space for spreading out solar panels.
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Family
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Cited Art Landscape
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