Conductive resinous composites
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United States of America Patent
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-
Sep 9, 1986
Issued Date -
N/A
app pub date -
May 31, 1983
filing date -
Jul 19, 1982
priority date (Note) -
Expired
status (Latency Note)
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Abstract
This invention is directed to resinous compositions which are generally metal-filled and which also contain hard filler materials. This combination produces unexpectedly better electrical conductivity than metal-filled material without the hard filler materials. Meanwhile there can be retained the resinous composition's ability to be quickly fabricated by simple molding technique into structurally sound rigid articles which are electrically conductive.
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