Importance

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Abstract

A high-speed silver plating solution for electroplating silver on a substrate which consists of a less-noble metal, such as copper, copper alloy, copper-plated base metal, iron, ferroalloy, nickel, or nickel alloy, characterized in that a cyclic compound whose ring includes a thioureylene radical ##STR1## (in which R.sub.1 and R.sub.2 are hydrogen or an alkyl or aryl group each) is added to the solution in a sufficient amount to prevent silver deposition by displacement reaction, whereby the silver deposition on the substrate is avoided. There is also provided a pretreating solution including the aforementioned compound for dipping the substrate prior to the silver plating.

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First Claim