Spring finger interconnect for IC chip carrier
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United States of America Patent
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-
Oct 7, 1986
Issued Date -
N/A
app pub date -
Nov 1, 1985
filing date -
Oct 28, 1983
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
Apparatus and method for electrically interconnecting two integrated circuit boards, which includes spring finger contact pads positioned on one board which are matched to raised contact pads on a second board in a manner such that the assembly is easily disassembled and reconnectable and such that it provides for exact height registration between boards. Accurate height registration is required when, for example, an electro-optical device referenced with respect to an optical system is mounted on one of the circuit boards.
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