Corrosion resistant lid for semiconductor package
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United States of America Patent
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-
Nov 4, 1986
Grant Date -
N/A
app pub date -
Apr 22, 1985
filing date -
Apr 22, 1985
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A lid for closing an electronic package that exhibits high resistance to corrosion. The lid includes a metal substrate and a multi-layered protective coating which has low porosity when compared to a single layer coating of the same thickness yet has good soldering properties that enables the lid to be hermetically sealed to the package container. The multi-layer coating includes an initial electroplated layer of nickel followed by a thin interlayer of a noble metal and a second layer of nickel electroplated over noble metal. A top layer of gold is then electroplated over the nickel-noble metal-nickel sandwich to complete the lid structure.
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