Method for detecting endpoint of development

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United States of America Patent

PATENT NO 4621037
SERIAL NO

06752714

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Abstract

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A method for detecting an endpoint of development including the steps of; forming a resist layer on a conductive layer formed on a substrate; exposing the resist layer by using light, X-rays, or electron beams; forming one electrode by connecting a connector consisting of a first conductive material to the conductive layer through the exposed resist layer on the substrate; forming another electrode by dipping an assembly consisting of a second conductive material into a developing solution; and developing the exposed resist layer while monitoring the current flowing between two electrodes.

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Patent Owner(s)

Patent OwnerAddress
SIGMA CORPORATION2-8-15 KURIGI ASAO-KU KAWASAKI-SHI KANAGAWA 215-0033

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Kanda, Kaoru Yokohama, JP 9 154
Kanda, Kunihiko Yokohama, JP 2 74

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