US Patent No: 4,622,058

Number of patents in Portfolio can not be more than 2000

Formation of a multi-layer glass-metallized structure formed on and interconnected to multi-layered-metallized ceramic substrate

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Abstract

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In the fabrication of an interconnection package for a plurality of semiconductors or integrated circuit chips wherein a multi-layered glass or glass-ceramic superstructure with a multi-layered distribution of planar conductors is formed by a process forming vertical conductive interconnection or studs between planar conductor layers, by pre-forming a via configuration in each glass or glass-ceramic layer at the interconnection points followed by depositing the conductive studs therein. The via configuration is formed by defining a desired pattern of vias, and ablating the vias through the top of and through the glass or glass-ceramic layer, using an ultraviolet laser. The vias may be stepped-shoulder or counter-bored by using a two mask operation.

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Patent Owner(s)

Patent OwnerAddressTotal Patents
INTERNATIONAL BUSINESS MACHINES CORPORATIONARMONK, NY75732

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Leary-Renick, Pamela A Fishkill, NY 1 53
Srinivasan, Rangaswamy 2508 Dunning Dr., Yorktown Heights, NY 10598 10 684

Cited Art Landscape

Patent Info (Count) # Cites Year
 
INTERNATIONAL BUSINESS MACHINES CORPORATION (2)
4,439,270 Process for the controlled etching of tapered vias in borosilicate glass dielectrics 40 1983
4,478,677 Laser induced dry etching of vias in glass with non-contact masking 54 1983
 
ARADIGM CORPORATION (1)
4,508,749 Patterning of polyimide films with ultraviolet light 105 1983

Patent Citation Ranking

Forward Cite Landscape

Patent Info (Count) # Cites Year
 
INTERNATIONAL BUSINESS MACHINES CORPORATION (11)
4,970,106 Thin film multilayer laminate interconnection board 31 1990
5,136,124 Method of forming conductors within an insulating substrate 15 1990
5,146,674 Manufacturing process of a high density substrate design 19 1991
5,266,446 Method of making a multilayer thin film structure 93 1992
5,338,900 Structures for electrically conductive decals filled with inorganic insulator material 25 1992
5,940,729 Method of planarizing a curved substrate and resulting structure 17 1996
5,858,254 Multilayered circuitized substrate and method of fabrication 1 1997
5,817,543 Method of constructing an integrated circuit memory 7 1997
6,133,139 Self-aligned composite insulator with sub-half-micron multilevel high density electrical interconnections and process thereof 23 1997
6,294,835 Self-aligned composite insulator with sub-half-micron multilevel high density electrical interconnections and process thereof 13 1999
6,150,255 Method of planarizing a curved substrate and resulting structure 6 1999
 
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. (8)
5,567,336 Laser ablation forward metal deposition with electrostatic assisted bonding 27 1995
6,211,080 Repair of dielectric-coated electrode or circuit defects 7 1996
5,935,462 Repair of metal lines by electrostatically assisted laser ablative deposition 11 1996
6,180,912 Fan-out beams for repairing an open defect 2 1998
6,060,127 Mechanically restricted laser deposition 7 1998
6,211,487 Printed circuit board and method of manufacturing the same 5 1999
6,576,523 Layered product, capacitor and a method for producing the layered product 7 2000
6,838,153 Layered product, capacitor and a method for producing the layered product 1 2002
 
Max Levy Autograph, Inc. (6)
4,897,676 High-density circuit and method of its manufacture 10 1988
5,162,191 High-density circuit and method of its manufacture 3 1989
5,317,342 High-density print head 1 1992
5,416,502 High-density circuit and method of its manufacture 0 1994
5,488,394 Print head and method of making same 0 1994
5,624,708 High-density circuit and method of its manufacture 2 1994
 
MICRON TECHNOLOGY, INC. (3)
8,288,859 Semiconductor device packages including a semiconductor device and a redistribution element 1 2011
8,486,825 Methods of forming semiconductor device packages including a semiconductor device and a redistribution element, methods of forming redistribution elements and methods for packaging semiconductor devices 0 2012
8,749,050 Redistribution elements and semiconductor device packages including semiconductor devices and redistribution elements 0 2013
 
QUALCOMM INCORPORATED (3)
8,535,976 Method for fabricating chip package with die and substrate 0 2003
8,471,361 Integrated chip package structure using organic substrate and method of manufacturing the same 0 2011
8,492,870 Semiconductor package with interconnect layers 0 2011
 
ELECTRO SCIENTIFIC INDUSTRIES, INC. (2)
5,841,099 Method employing UV laser pulses of varied energy density to form depthwise self-limiting blind vias in multilayered targets 121 1996
6,025,256 Laser based method and system for integrated circuit repair or reconfiguration 43 1997
 
FUJITSU LIMITED (2)
5,916,453 Methods of planarizing structures on wafers and substrates by polishing 18 1996
6,733,685 Methods of planarizing structures on wafers and substrates by polishing 35 2001
 
INTEL CORPORATION (2)
7,749,900 Method and core materials for semiconductor packaging 3 2008
8,456,016 Method and core materials for semiconductor packaging 0 2010
 
TYCO ELECTRONICS UK LTD. (2)
5,631,447 Uses of uniaxially electrically conductive articles 5 1995
5,678,287 Uses of uniaxially electrically conductive articles 21 1995
 
BULL S.A. (1)
5,082,718 Method for depositing an insulating layer on a conductive layer of a multi-layer connection board of one very large scale integrated circuit 5 1990
 
CURAMIK ELECTRONICS GMBH (1)
8,342,384 Method for the production of a metal-ceramic substrate, preferably a copper ceramic substrate 0 2012
 
ELECTROVA AG (1)
8,584,924 Method for the production of a metal-ceramic substrate, preferably a copper ceramic substrate 0 2003
 
GORE ENTERPRISE HOLDINGS, INC. (1)
5,868,950 Method to correct astigmatism of fourth yag to enable formation of sub 25 micron micro-vias using masking techniques 13 1996
 
HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P. (1)
4,940,508 Apparatus and method for forming die sites in a high density electrical interconnecting structure 20 1989
 
HITACHI, LTD. (1)
5,177,670 Capacitor-carrying semiconductor module 119 1992
 
IBIDEN CO., LTD. (1)
5,022,960 Method of manufacturing circuit board for mounting electronic components 23 1990
 
MATSUSHITA ELECTRIC CORPORATION OF AMERICA (1)
5,683,601 Laser ablation forward metal deposition with electrostatic assisted bonding 15 1996
 
MICROELECTRONICS AND COMPUTER TECHNOLOGY CORPORATION (1)
5,236,551 Rework of polymeric dielectric electrical interconnect by laser photoablation 72 1992
 
MINI-SYSTEMS, INC. (1)
6,432,564 Surface preparation of a substrate for thin film metallization 0 1999
 
NEC CORPORATION (1)
5,322,593 Method for manufacturing polyimide multilayer wiring substrate 20 1992
 
NGK SPARK PLUG CO., LTD. (1)
5,196,089 Multilayer ceramic substrate for mounting of semiconductor device 7 1991
 
OMRON CORPORATION (1)
6,008,468 Method and apparatus for producing a thin mesh utilizing a laser and mask system 24 1997
 
ROUND ROCK RESEARCH, LLC (1)
6,998,344 Method for fabricating semiconductor components by forming conductive members using solder 48 2004