Importance

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Abstract

A printed circuit board is produced by forming a masking layer with a non-masking circuit pattern on the surface of a base plate by an ink which can be detached from the plate forming a metal layer on the plate with the masking layer by vacuum evaporation or sputtering, and then removing the ink of the masking layer and the metal provided thereon from the base plate, leaving the remaining metal as a circuit. To produce a circuit board with a circuit consisting of many metal portions which are separated and insulated from each other, after forming the metal layer, the following steps are effected: forming a second masking layer on the metal layer, the second layer having a non-masking circuit pattern which is the same as that of the first masking layer, the pattern of the second layer being aligned with that of the first layer, then plating the plate by putting the plate into a plating bath and connecting a plating electrode to the metal layer so that additional metal is plated on those portions of the metal layer which are not masked by the second masking layer, and removing the ink of the first masking layer and the metal thereon and the second masking layer provided on the first masking layer, leaving the remaining metal as a circuit.

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First Claim