Semiconductor chip with recessed bond pads
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United States of America Patent
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-
Nov 11, 1986
Grant Date -
N/A
app pub date -
Jul 29, 1985
filing date -
Jul 29, 1985
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A semiconductor chip having bond pads formed on a peripheral ledge recessed below the active chip surface. Ultrasonic wire bonds are made with the pads to lie below the active chip surface.
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