Automatic assembly of integrated circuits
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United States of America Patent
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-
Dec 9, 1986
Grant Date -
N/A
app pub date -
Mar 22, 1984
filing date -
Mar 22, 1984
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A system for the assembly and packaging of integrated circuits employs circuit dice that have contact pads in a standard array; a leadframe having leads configured to have the same spring constant; a method for removing selected dice from a wafer array under computer control; and a method of simultaneously bonding all leads to the die.
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