Method for forming a protective film on a semiconductor body

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United States of America Patent

PATENT NO 4627991
SERIAL NO

06610638

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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In the representative embodiment of the invention described in the specification, a boron coating is applied to a semiconductor body having a protective film of a compound of the semiconductor material by heating the semiconductor body to a temperature below 400.degree. C. in a vacuum chamber, introducing diborane gas into the chamber and causing a glow discharge between two electrodes in the chamber.

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Patent Owner(s)

  • FUJI ELECTRIC CO., LTD.;FUJI ELECTRIC CORPORATE RESEARCH AND DEVELOPMENT LTD., A CORP. OF JAPAN;FUJI ELECTRIC CORPORATE RESEARCH AND DEVELOPMENT, LTD.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Ishiwata, Osamu Kanagawa, JP 5 28
Sato, Noritada Kanagawa, JP 20 162
Seki, Yasukazu Tokyo, JP 23 339

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