Forming electrical conductors in long microdiameter holes

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 4628174
SERIAL NO

06651014

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ATTORNEY / AGENT: (SPONSORED)

Importance

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Abstract

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A conductor is provided through a narrow bore hole of a wafer. The hole has a length-to-diameter ratio in excess of six. The conductor is formed by condensation of metal vapor generated at the bottom of said hole by a spark. The spark is generated between a vaporizable metal at the bottom of the hole and a thin electrode disposed above the hole from a conventional automobile coil and battery operating through a mercury switch.

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First Claim

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Patent Owner(s)

Patent OwnerAddressTotal Patents
GENERAL ELECTRIC COMPANYSCHENECTADY, NY19183
INTERSIL CORPORATIONPALM BAY, FL242

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Anthony, Thomas R Schenectady, NY 81 1989

Cited Art Landscape

Patent Info (Count) # Cites Year
 
VAPOR TECHNOLOGIES, INC. (1)
* 4505948 Method of coating ceramics and quartz crucibles with material electrically transformed into a vapor phase 15 1984
* Cited By Examiner

Patent Citation Ranking

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Patent Info (Count) # Cites Year
 
Tri-Si Technologies, Inc. (1)
6664129 Integrated circuits and methods for their fabrication 287 2002
 
HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP (1)
7804175 Semiconductor structures including conductive vias continuously extending therethrough and methods of making the same 2 2007
 
THERMO ELECTRON TECHNOLOGIES, WALTHAM, MA, A CORP OF CA (1)
* 5062936 Method and apparatus for manufacturing ultrafine particles 28 1989
 
INTEL CORPORATION (5)
6908845 Integrated circuit die and an electronic assembly having a three-dimensional interconnection scheme 14 2002
6848177 Integrated circuit die and an electronic assembly having a three-dimensional interconnection scheme 48 2002
* 2003/0183,943 Integrated circuit die and an electronic assembly having a three-dimensional interconnection scheme 10 2002
* 2003/0186,486 Integrated circuit die and an electronic assembly having a three-dimensional interconnection scheme 1 2002
7112887 Integrated circuit die and an electronic assembly having a three-dimensional interconnection scheme 8 2004
 
ELECTRO SCIENTIFIC INDUSTRIES, INC. (1)
* 5614114 Laser system and method for plating vias 141 1994
 
GM GLOBAL TECHNOLOGY OPERATIONS LLC (1)
* 6159831 Process to prepare an array of wires with submicron diameters 12 1998
 
INVENSAS CORPORATION (11)
6184060 Integrated circuits and methods for their fabrication 353 1998
6322903 Package of integrated circuits and vertical integration 477 1999
6639303 Integrated circuits and methods for their fabrication 252 1999
6420209 Integrated circuits and methods for their fabrication 25 2000
6717254 Devices having substrates with opening passing through the substrates and conductors in the openings, and methods of manufacture 60 2001
6498074 Thinning and dicing of semiconductor wafers using dry etch, and obtaining semiconductor chips with rounded bottom edges and corners 51 2001
6882030 Integrated circuit structures with a conductor formed in a through hole in a semiconductor substrate and protruding from a surface of the substrate 272 2002
* 2002/0084,513 Integrated circuits and methods for their fabrication 18 2002
6740582 Integrated circuits and methods for their fabrication 267 2002
* 2002/0127,868 Integrated circuits and methods for their fabrication 4 2002
6753205 Method for manufacturing a structure comprising a substrate with a cavity and a semiconductor integrated circuit bonded to a contact pad located in the cavity 55 2003
 
Thermo Electron Technologies Corporation (1)
* 5194128 Method for manufacturing ultrafine particles 24 1991
 
TRU-SI TECHNOLOGIES, INC. (1)
6787916 Structures having a substrate with a cavity and having an integrated circuit bonded to a contact pad located in the cavity 111 2001
* Cited By Examiner