US Patent No: 4,628,174

Number of patents in Portfolio can not be more than 2000

Forming electrical conductors in long microdiameter holes

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Importance

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Abstract

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A conductor is provided through a narrow bore hole of a wafer. The hole has a length-to-diameter ratio in excess of six. The conductor is formed by condensation of metal vapor generated at the bottom of said hole by a spark. The spark is generated between a vaporizable metal at the bottom of the hole and a thin electrode disposed above the hole from a conventional automobile coil and battery operating through a mercury switch.

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First Claim

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Patent Owner(s)

  • GENERAL ELECTRIC COMPANY;INTERSIL CORPORATION

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Anthony, Thomas R Schenectady, NY 81 1937

Cited Art Landscape

Patent Info (Count) # Cites Year
 
Other [Check patent profile for assignment information] (1)
* 4,505,948 Method of coating ceramics and quartz crucibles with material electrically transformed into a vapor phase 15 1984
* Cited By Examiner

Patent Citation Ranking

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Patent Info (Count) # Cites Year
 
Other [Check patent profile for assignment information] (23)
* 5,062,936 Method and apparatus for manufacturing ultrafine particles 28 1989
* 5,194,128 Method for manufacturing ultrafine particles 24 1991
* 5,614,114 Laser system and method for plating vias 141 1994
6,184,060 Integrated circuits and methods for their fabrication 336 1998
* 6,159,831 Process to prepare an array of wires with submicron diameters 12 1998
6,322,903 Package of integrated circuits and vertical integration 452 1999
6,639,303 Integrated circuits and methods for their fabrication 237 1999
6,420,209 Integrated circuits and methods for their fabrication 24 2000
6,717,254 Devices having substrates with opening passing through the substrates and conductors in the openings, and methods of manufacture 57 2001
6,498,074 Thinning and dicing of semiconductor wafers using dry etch, and obtaining semiconductor chips with rounded bottom edges and corners 51 2001
6,787,916 Structures having a substrate with a cavity and having an integrated circuit bonded to a contact pad located in the cavity 105 2001
6,882,030 Integrated circuit structures with a conductor formed in a through hole in a semiconductor substrate and protruding from a surface of the substrate 255 2002
* 2002/0084,513 Integrated circuits and methods for their fabrication 15 2002
6,908,845 Integrated circuit die and an electronic assembly having a three-dimensional interconnection scheme 14 2002
6,848,177 Integrated circuit die and an electronic assembly having a three-dimensional interconnection scheme 48 2002
* 2003/0183,943 Integrated circuit die and an electronic assembly having a three-dimensional interconnection scheme 9 2002
* 2003/0186,486 Integrated circuit die and an electronic assembly having a three-dimensional interconnection scheme 0 2002
6,740,582 Integrated circuits and methods for their fabrication 251 2002
* 2002/0127,868 Integrated circuits and methods for their fabrication 3 2002
6,664,129 Integrated circuits and methods for their fabrication 269 2002
6,753,205 Method for manufacturing a structure comprising a substrate with a cavity and a semiconductor integrated circuit bonded to a contact pad located in the cavity 53 2003
7,112,887 Integrated circuit die and an electronic assembly having a three-dimensional interconnection scheme 8 2004
7,804,175 Semiconductor structures including conductive vias continuously extending therethrough and methods of making the same 1 2007
* Cited By Examiner