Method of forming corrosion resistant film on the surface of substrate composed of copper or copper alloy
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United States of America Patent
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-
Jan 6, 1987
Grant Date -
N/A
app pub date -
May 15, 1985
filing date -
Jun 4, 1984
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A method of forming a corrosion resistant film for a specified image on the surface of a substrate by adding an aliphatic amine such as ethylenediamine, monoethanolamine, diethanolamine triethanolamine to a sensitizing solution composed of water-soluble high molecular compound and ammonium dichromate so as to adjust pH value of the sensitizing solution in the range of 6.1 to 7.8, applying the prepared sensitizing solution to the surface of a substrate of copper or copper alloy, and undergoing each process of drying, exposure and development. After an etching process being applied to the substrate on the surface of which the corrosion resistant film has been formed, the corrosion resistant film is removed to be a finished goods.
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