Method for etching copper and composition useful therein
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United States of America Patent
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Jan 13, 1987
Grant Date -
N/A
app pub date -
Jun 20, 1985
filing date -
Jun 20, 1985
priority date (Note) -
Expired
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Abstract
A composition of matter comprising sulfuric acid and guanidine, aminoguanidine, or formylated aminoguanidine. The composition is useful in the preparation of sulfuric acid/hydrogen peroxide etching solutions and in methods for etching copper, most particularly in the manufacture of printed circuits.
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