Method and compositions for removal of moisture
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United States of America Patent
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-
Jan 20, 1987
Issued Date -
N/A
app pub date -
Dec 26, 1985
filing date -
Oct 15, 1984
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
Methods and compositions are disclosed for absorbing moisture when moisture constraints are present. The moisture absorbing compositions include a curable epoxy resin, a curing agent, and an anhydride of a carboxylic acid. In one embodiment, the anhydride component is present in an amount sufficient both to cure the resin and to absorb the moisture. In other embodiments, a separate curing agent is included. Methods employing such compositions as adhesives or coatings, particularly in electronic device packaging, also are disclosed.
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Cited Art Landscape
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