Semiconductor material on a substrate, said substrate comprising, in order, a layer of organic polymer, a layer of metal or metal alloy and a layer of dielectric material
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Jan 27, 1987
Issued Date -
N/A
app pub date -
Jul 2, 1984
filing date -
Jul 2, 1984
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
There is disclosed a substrate having thereon a layer of a semiconductor material, and a method for depositing and heating the semiconductor material on the substrate, wherein the substrate comprises a layer of organic polymer, a layer of metal or metal alloy, and a layer of dielectric material wherein the layer of dielectric material has a surface, remote from the metal, that is contiguous with the semiconductor material.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully