Hermetic chip carrier compliant soldering pads
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United States of America Patent
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-
Feb 3, 1987
Grant Date -
N/A
app pub date -
May 1, 1985
filing date -
May 1, 1985
priority date (Note) -
Expired
status (Latency Note)
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Abstract
Compliant soldering pads allow for expansion and contraction between an hermetic chip carriers (HCC) and printed wiring boards (PWB) due to coefficient of thermal expansion mismatch and prevent solder cracking which in turn causes electrical discontinuities. The pads allow for flexing in three axes.
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