Method for printed circuit board and/or printed wiring board cleaning
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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-
Feb 3, 1987
Grant Date -
N/A
app pub date -
Jul 1, 1985
filing date -
Jul 1, 1985
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
Methods and compositions are provided for the removal of rosin soldering flux and adhesive tape residues from printed circuit and/or wiring boards, and for testing the quality of curing of U.V.-cured soldermask on such boards. The compositions of the invention contain terpene compounds, preferably in combination with terpene emulsifying surfactants to facilitate removal by rinsing in water.
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Cited Art Landscape
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