Thick film delay line comprising a plurality of stacked delay assemblies formed by a printing process
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United States of America Patent
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-
Feb 3, 1987
Issued Date -
N/A
app pub date -
Jul 31, 1985
filing date -
Mar 25, 1983
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
The thick film delay line of the present invention comprises a substrate having a plurality of conductive pads mounted along the edge thereof. A plurality of delay circuit assemblies are stacked on the upper surface of the substrate. Each delay circuit comprises a solid sheet of conductive material, a first layer of dielectric material superimposed over the solid conductor sheet, a spiral coil conductor having its opposite ends connected to two separate contact pads, and a second sheet of dielectric material covering the spiral conductor. The spiral conductors within each of the delay circuit assemblies are connected to one another in series.
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