Semiconductor package with contact springs
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United States of America Patent
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-
Feb 3, 1987
Issued Date -
N/A
app pub date -
Jul 11, 1986
filing date -
Jan 26, 1981
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
An integrated circuit package for high density applications comprises spring contacts on one face thereof for its removable mounting onto a printed circuit board, the mounting being accomplished by means of a frame assembly and the package being automatically fabricable in a continuous flow process involving its assembly on a transport tape and its final cutting therefrom.
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