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Abstract

A system for automatic micro and macro inspection of patterned wafers, including a X-Y stage for supporting and positioning a wafer at a macro inspection station and a micro inspection station, a plurality of cassettes for storing a plurality of patterned wafers before and after inspection, a transfer arm and apparatus for transferring a wafer from the cassettes to a predetermined location on the X-Y stage, apparatus for centering the wafer on the macro inspection station, apparatus for aligning the wafer to obtain a preselected orientation for macro inspection, an optical system for effecting macro inspection of the wafer and storing a unique image thereof, apparatus for moving the wafer from the macro inspection station to the micro inspection station so that the area of the wafer corresponding to the stored unique image is in a micro optical path, autofocus apparatus for automatically focusing the lowest magnification objective lens on the area of the wafer to derive a real time image, a comparitor for comparing the stored unique image to the real time image, apparatus responsive to the comparison of the stored unique image and the real time image and operative to more precisely position the wafer in the micro optical path, apparatus for using areas of the wafer displaced one from the other to obtain more precise alignment of the wafer, apparatus for performing a pre-established micro inspection of selected areas of the wafer and apparatus for returning the wafer to a storage cassette.

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First Claim