High-density electronic processing package--structure and fabrication
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United States of America Patent
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Feb 24, 1987
Issued Date -
N/A
app pub date -
Apr 8, 1985
filing date -
Sep 16, 1980
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A high-density electronic package module is disclosed which comprises a stack of semiconductor chips having integrated circuitry on each chip. To permit the emplacement of thin film circuitry on the access ends, each access plane is etched to cut back the semiconductor material then covered with passivation material, and thereafter lapped to uncover the ends of electrical leads on the chips.
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