Thermoformable multilayer barrier structures
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United States of America Patent
Stats
-
Mar 3, 1987
Grant Date -
N/A
app pub date -
Oct 7, 1985
filing date -
Oct 7, 1985
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A multilayer thermoformable packaging material is provided and includes one layer of barrier material containing a resin having low gas and vapor transmission properties. The multilayer structure also includes one layer which utilizes scrap produced from the multilayer structure. Other optional layers may be included in the structure to provide additional features such as rigidity and toughness.
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Cited Art Landscape
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