Integrated circuit package, and method of forming an integrated circuit package
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Mar 3, 1987
Grant Date -
N/A
app pub date -
May 20, 1985
filing date -
May 20, 1985
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
An integrated circuit package comprises an integrated circuit chip and a flexible sheet-form interconnect member that comprises dielectric material and conductor runs supported by the dielectric material in mutually-insulated relationship and having termination points arranged at the main face of the interconnect member in a pattern that corresponds with the pattern of contact pads on the interconnect face of the chip. The chip and the interconnect member are adhesively bonded together by means of a material that is interposed between the main face of the interconnect member and the interconnect face of the chip, but is not interposed between the contact pads and the termination points, and adheres to both the interconnect member and the chip.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully