Semiconductor package with tape mounted die
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United States of America Patent
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-
Mar 10, 1987
Grant Date -
N/A
app pub date -
Jan 15, 1985
filing date -
Jan 15, 1985
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A semiconductor package has a molded-in-place lead frame (15) resting on a ledge (12b) adjacent a die-receiving trough (13) in a molded housing (10). A one-layer or two-layer flexible tape includes a depending tab (22) on which a die (30) is bonded and positioned within the trough. Electrical bonds are made between bond pads (42) on the die, either by wire bonds (29) or thermo-compression bonding using connector bumps (32), and bond pads on the tape. The tape is laid across a pair of ledges (12a, 12b) with the depending die resting on the bottom of the trough. The tape bond pads are then bonded to inner-extending contact fingers (18) of the lead frame. A single-in-line package is provided in one embodiment wherein integral contacts (17) extend outwardly from fingers (18) exterior of the housing (10).
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Cited Art Landscape
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