Method of making packaged IC chip
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United States of America Patent
Stats
-
Mar 31, 1987
Issued Date -
N/A
app pub date -
Jan 27, 1986
filing date -
May 2, 1984
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
In the manufacture of a packaged IC chip, a lead frame segment has a plurality of leads, the ends of which are connected to opposing rails. After the leads are secured to a lead frame support, the rails are removed and an IC chip is then connected. The chip and lead frame are then encapsulated between the support and a cover.
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