Polishing system with underwater Bernoulli pickup
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United States of America Patent
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-
Mar 31, 1987
Grant Date -
N/A
app pub date -
Nov 1, 1985
filing date -
Nov 1, 1985
priority date (Note) -
Expired
status (Latency Note)
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Abstract
An automatic polishing system for polishing semiconductor material is described. A robot and Bernoulli pickup are used to retrieve polished wafers from an underwater unload station which is located on a wafer polisher. The polished wafer is then deposited into a cassette which is located underwater.
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