Method for reflow soldering of surface mounted devices to printed circuit boards
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United States of America Patent
Stats
-
Mar 31, 1987
Issued Date -
N/A
app pub date -
Sep 13, 1985
filing date -
Jan 18, 1984
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A multi-zone thermal process system utilizing nonfocused infrared panel emitters. An insulated housing has a plurality of zones each having separate panel emitters which heat a product load traveling through the zone and in close proximity to said panel(s) at different peak wavelengths in each zone. The panel emitters emit infrared wavelengths in the middle and far regions. The temperature differences across each zone and between the panel and product are held to a minimum. A specific application of the system is for accomplishing reflow soldering of surface mount devices to printed circuit boards.
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