Solderless connection apparatus
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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-
Apr 7, 1987
Grant Date -
N/A
app pub date -
Jan 7, 1985
filing date -
Jan 7, 1985
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A solderless connector wherein mechanical means applies a force against an elastomeric element to effect electrical contact between terminal portion of printed circuit devices is presented. The solderless connector comprises a flexible circuit sheet which is wrapped around a compressible element to provide exposed contact pads and is especially well suited to connect a leadless electronic package, i.e., chip carrier or leadless DIP package, to a circuit board.
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