Multi-chip packaging system

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 4657137
SERIAL NO

06266564

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ATTORNEY / AGENT: (SPONSORED)

Importance

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Abstract

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A system for packaging leadless electronic and electrical components for automatic component placement machines including a low-cost, disposable, flexible engineered laminated carrier tape on which leadless components are held, a reel for winding said component tape, the reel being fabricated with a core of solid fiber chipboard and side discs sheets of coated kraft paper such that the carrier tape may be sealed within the coated paper side sheets of the reel and peeled from side sheets while unwinding. The flexible engineered laminated carrier tape includes a stable base layer member, a flexible, expandable and compressible upper member layer of the laminated carrier tape structure, and a creped top cover tape as required including tape drive engaging means integrally formed with said base layer member and spaced recessed areas formed in said carrier tape for receiving leadless components, and further including means to determine the presence or absence of components in each of said recessed areas after the carrier tape is loaded with components.

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First Claim

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Patent Owner(s)

Patent OwnerAddress
NORTH AMERICAN PHILIPS CORPORATION A CORP OF DE100 EAST 42ND STREET NEW YORK NY 10017

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Johnson, Carl W Neenah, WI 18 383

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