Plasma developable negative resist compositions for electron beam, X-ray and optical lithography
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United States of America Patent
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Apr 14, 1987
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N/A
app pub date -
May 14, 1985
filing date -
Jun 27, 1983
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Expired
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Abstract
A negative resist composition including a polymeric matrix material, a polymerizable monomer, and an onium salt radiation sensitive initiator. The monomer is polymerized by irradiating the resist with an e-beam, x-ray, or ultraviolet source and heating the exposed resist. The resist is developed by a dry etchant such as plasma or a reactive ion etchant.
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