Curable resinous composition comprising epoxy resin and silicon-containing elastomeric polymer

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United States of America Patent

PATENT NO 4657986
SERIAL NO

06812378

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Abstract

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A curable resinous composition comprising: (A) an organic elastomeric polymer having at least one silicon-containing reactive group in a molecule, (B) an epoxy resin, (C) a silicone compound having a silicon-containing group and a functional group reactive with an epoxy group, and (D) a curing agent for the epoxy resin, wherein said silicon-containing reactive group is a group of the formula: ##STR1## wherein X is a hydroxyl group or a hydrolyzable group, R.sup.1 is a monovalent hydrocarbon group having 1 to 20 carbon atoms or an organosiloxy group, 'a' is 0, 1, 2, or 3, 'b' is 0, 1 or 2 provided that the total of 'a' and 'b' is at least 1, and 'm' is 0 or an integer of 1 to 18, a weight ratio of (A) to (B) being from 1:100 to 100:1 and a weight ratio of (A)+(B) to (C) being from 100:0.1 to 100:20.

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Patent Owner(s)

Patent OwnerAddress
KANEGAFUCHI CHEMICAL INDUSTRY CO LTDNO 2-4 NAKANOSHIMA 3-CHOME KITA-KU OSAKA-SHI OSAKA-FU

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Hirose, Toshifumi Kobe, JP 31 826
Isayama, Katsuhiko Kobe, JP 44 1347
Iwahara, Takahisa Kobe, JP 21 576
Kawakubo, Fumio Kobe, JP 28 735

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