Compliant layer printed circuit board
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Apr 14, 1987
Issued Date -
N/A
app pub date -
Sep 19, 1985
filing date -
Apr 4, 1983
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A printed circuit board having a compliant layer sandwiched between a pattern of conductors and an insulating layer. The printed circuit board has leadless chip carriers attached to soldering pads on the board using conventional soldering techniques. The elasticity of the compliant layer between the pattern of conductors and the insulating layer provides mechanical decoupling for minimizing stresses on the solder joints due to the different thermal coefficients of expansion of contiguous materials.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully