Electroless plating process and process for producing multilayer wiring board
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United States of America Patent
Stats
-
Apr 21, 1987
Grant Date -
N/A
app pub date -
Oct 10, 1985
filing date -
Oct 11, 1984
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
In a selective electroless plating process suitable for formation and correction of a minute pattern by plating film, irradiation of the surface of a workpiece with a laser beam serves to selectively activate the surface of the workpiece to allow an electroless plating film to deposited on only the activated portions. The portion of the workpiece where plating is effected is irradiated with a radiation energy beam to form a damaged portion, which is contact with a plating bath during and/or after the irradiation to selectively from a plating film on the damaged portion. The portion of a workpiece where a pole as the connector part of a multilayer wiring board is to be formed is irradiated with a laser beam and allowed to have a pole selectively formed only thereon.
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