Process and composition for sensitizing articles for metallization
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
May 5, 1987
Issued Date -
N/A
app pub date -
Dec 22, 1976
filing date -
Jul 11, 1972
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
Non-metallic articles are sensitized for deposition of adherent metal from electroless metal solutions in contact therewith by treatment with a first medium including cuprous ions and stannous ions thereby absorbing on the surface in situ at least said cuprous ions; thereafter treating the surface with a second medium to decrease the solubility of the cuprous ions and/or simultaneously removing the excess; and simultaneously or subsequently, if necessary, treating the surface with one or more agents to transfer said cuprous ions into a catalytically-active state.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully