Printed circuit board and method of manufacturing same
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United States of America Patent
Stats
-
May 5, 1987
Grant Date -
N/A
app pub date -
Jan 15, 1985
filing date -
Jan 17, 1984
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
The present invention relates to a printed circuit board and to a method of manufacturing the same. The printed circuit board of the present invention consists of a metal board glued to a resin board which is provided with at least one circuit layer. The metal board is provided with holes which are filled with resin, and lead wire holes are provided at the centers of the resin filled holes. The resin board is provided with through holes. The center of the lead wire holes and the centers of the through holes are on identical lines. Further, the method of manufacturing a printed circuit board under the present invention is to provide resin holes on a metal board, filling the holes with resin, and providing lead wire holes at the centers of the resin filled holes. In this process, an identical hole position designating means is used for providing the resin holes and the lead wire holes. At least one circuit layer and through holes are to be provided on the resin board. Thereafter, the metal board and the resin board are glued together. In this process, the centers of the lead wire holes and the centers of the through holes are to be put on identical lines.
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Family
International Classification(s)
Cited Art Landscape
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