Method of interconnecting conductors of different layers of a multilayer printed circuit board
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United States of America Patent
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-
May 12, 1987
Grant Date -
N/A
app pub date -
Dec 2, 1985
filing date -
Dec 11, 1984
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
The invention relates to a method of interconnecting conductors of different layers of a multilayer printed circuit board by forming a depression in the relevant conductor of the outermost layer, so that the insulation layer(s) is deformed and contact is made between the outermost layer and the appropriate conductor(s) of the next layer or layers. The method can suitably be used in multilayer printed circuits on a substrate and in flexible multilayer printed circuits on an electrically insulating foil. In the latter case a temporary backing surface is required for the depression process. The substrate or the temporary backing surface must be deformable to a sufficient degree.
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