Docking apparatus
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United States of America Patent
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-
May 12, 1987
Grant Date -
N/A
app pub date -
Mar 11, 1985
filing date -
Mar 11, 1985
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
Docking apparatus for a semiconductor wafer prober (16). A cylindrical housing assembly provides an electrical interface between pads on the wafer (22) and contacts on the load board (76) of a test head (12) through a contact ring (74). The housing assembly is in two parts with a first part (29) clamped to a frame portion (30) of the prober and a second part (58) supported above the first part by compression springs (64). Limited angular movement is provided between the housing assembly and the prober frame. The separation between the housing members is maintained so that the force exerted on the contact ring in the docking process is determined by the compression of the springs.
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